Meshfree methods such as the Reproducing Kernel Particle Method (RKPM) are well suited for modeling materials and solids undergoing fracture and damage processes, and nodal integration is a natural choice for this class of problems. However, nodal integration suffers from spatial instability, and the excessive material deformation and damage process could also lead to kernel instability in RKPM. This presentation reviews the recent advances in nodal integration for meshfree methods that are stable, accurate, and with optimal convergence. A variationally consistent integration (VCI) is introduced to allow correction of many low order quadrature rules to achieve optimal convergence, and several stabilization techniques will be discussed. The application of the new RKPM formulation for fracture to damage multiscale mechanics and materials modeling, and their applications to the modeling of extreme events, will be demonstrated. These include the modeling of man-made disasters such as fragment-impact processes, penetration, shock and blast events, as well as natural disasters such as landslides will be presented to demonstrate the effectiveness of the new developments.
J. S. Chen received Ph.D. from Theoretical & Applied Mechanics, Northwestern University in 1989. He is currently the Inaugural William Prager Chair of Structural Engineering Department and the Director of Center for Extreme Events Research at UC San Diego. Before joining UCSD in October 2013, he was the Chancellor’s Professor of UCLA Civil & Environmental Engineering Department where he served as the Department Chair during 2007-2012. J. S. Chen’s research is in computational mechanics and multiscale materials modeling with specialization in the development of meshfree methods. He is the Past President of US Association for Computational Mechanics (USACM) and the Present of ASCE Engineering Mechanics Institute (EMI). He has received numerous awards, including the Computational Mechanics Award from International Association for Computational Mechanics (IACM). He is the Fellow of USACM, IACM, ASME, EMI, ICACM, and ICCEES.